A

1. Adhesive – Material used to fix components temporarily before soldering.
2. AOI (Automated Optical Inspection) – Machine vision system that checks solder joints and component placement.
3. Automation – Use of machines and control systems to perform repetitive tasks automatically.
4. Assembly Line – Sequence of processes for manufacturing electronic boards.
5. Alignment – The process of precisely positioning a component on a PCB pad.

B

6. BGA (Ball Grid Array) – Type of surface-mount package with solder balls on the bottom.
7. Batch Process – Manufacturing process that handles multiple units at once.
8. Bare Board – PCB without any components assembled.
9. Bonding – Process of connecting semiconductor dies or wires.
10. Burn-In Test – Long-term reliability test by operating components under stress.

C

11. Capacitor – Passive component that stores electric charge.
12. Chip Resistor – Small surface-mount resistor in rectangular shape.
13. Chip Component – Miniature passive device such as resistor, capacitor, or inductor.
14. Coating – Protective layer applied to the board after assembly.
15. Component Feeder – Device that supplies components to a pick-and-place machine.
16. Conveyor – Automated belt transporting PCBs through production stages.
17. Cooling Tunnel – Used to solidify solder after reflow.
18. Cleaning Process – Removes flux residues or contamination from boards.
19. Contact Pads – Exposed metal areas on PCB for soldering components.
20. CTQ (Critical To Quality) – Key process parameter affecting product quality.

D

21. Die – Bare semiconductor chip before packaging.
22. Depaneling – Process of separating PCBs from a panel.
23. DFM (Design for Manufacturability) – Designing PCBs to simplify assembly and reduce defects.
24. Dispensing – Applying solder paste or adhesive by syringe or valve.
25. Dry Film – Photosensitive material used in PCB manufacturing.

E

26. EIA-481 – Standard for carrier tape dimensions for SMD components.
27. ESD (Electrostatic Discharge) – Sudden electric current that can damage components.
28. Encapsulation – Process of sealing components for protection.
29. ERP (Enterprise Resource Planning) – Software for managing manufacturing operations.
30. Epoxy – Adhesive or potting material used in packaging.

F

31. Feeder – Device that holds and advances component tapes.
32. Flip Chip – Die attached face-down using solder bumps.
33. Flux – Chemical agent that removes oxides during soldering.
34. Functional Test – Electrical testing to verify circuit operation.
35. Fiducial Mark – Reference mark for machine vision alignment.

G

36. Gerber File – Standard format for PCB design output.
37. Ground Plane – PCB layer for reducing electrical noise.
38. Glue Dot – Small drop of adhesive to secure components.
39. Gold Plating – Surface finish for reliable solderability.
40. Gap Analysis – Comparison between actual and required performance.

H

41. Handling System – Equipment that moves boards between machines.
42. Heat Profile – Temperature curve during reflow soldering.
43. Hermetic Package – Airtight enclosure protecting sensitive components.
44. Humidity Control – Maintaining moisture level for component storage.
45. Hybrid Assembly – Combining SMT and through-hole components.

I

46. IC (Integrated Circuit) – Semiconductor device with multiple electronic functions.
47. ICT (In-Circuit Test) – Test using electrical probes to check circuits.
48. Inspection – Process of checking assembly quality.
49. Inline System – Machines connected in sequence for continuous production.
50. ISO 9001 – International standard for quality management systems.

J

51. JEDEC – Standardization body for semiconductor packaging.
52. Jig – Fixture used to hold a part during assembly or testing.
53. Jumper – Wire connection used to bridge PCB traces.
54. J-STD-001 – IPC standard for soldered electrical assemblies.
55. Jet Printing – Non-contact method for applying solder paste.

K

56. Kanban – Lean manufacturing method for inventory control.
57. Keypad Assembly – Integration of switches or buttons onto PCBs.
58. Kitting – Process of preparing components for assembly.
59. KIC Profile – Thermal profile measurement tool for reflow ovens.
60. K-value – Thermal conductivity indicator of materials.

L

61. Laser Marking – Engraving serial numbers or QR codes on PCBs.
62. Lead-Free Solder – Alloy without lead, meeting RoHS requirements.
63. Line Balancing – Distributing workload evenly across production.
64. Loader – Machine that feeds PCBs into a line.
65. Labeling System – Applies barcodes or identification labels.

M

66. MSL (Moisture Sensitivity Level) – Indicates handling requirements for ICs.
67. MCU (Microcontroller Unit) – Programmable control chip.
68. MLCC (Multi-Layer Ceramic Capacitor) – Common passive component in SMT.
69. Mounting Pressure – Force used to place a component accurately.
70. Masking – Process of covering areas to prevent soldering.

N

71. Nozzle – Pick-and-place head tip that picks components.
72. N2 Atmosphere – Nitrogen environment in reflow to reduce oxidation.
73. Non-Wet – Solder defect where solder fails to adhere to pad.
74. Networking – Linking machines for data communication.
75. Nickel Plating – Surface finish improving durability and solderability.

O

76. Optical Alignment – Vision-guided positioning of components.
77. Operator Panel – Interface for controlling automation systems.
78. Overprint – Excess solder paste beyond pad boundary.
79. Overmolding – Encapsulating part of an assembly with resin.
80. OEE (Overall Equipment Effectiveness) – Key metric for productivity.

P

81. Pick and Place Machine – Equipment that mounts SMDs on PCBs.
82. PCB (Printed Circuit Board) – Board connecting electronic components.
83. Package Type – Form of SMD housing, e.g., QFP, BGA, DFN.
84. Plasma Cleaning – Removes contamination using ionized gas.
85. Pad Layout – Copper pattern defining component footprint.
86. Pin Pitch – Distance between pins or leads.
87. Potting – Filling electronic assemblies with protective resin.
88. Placement Accuracy – Precision of component positioning.
89. Poka-Yoke – Error-proofing design in manufacturing.
90. Profile Oven – Reflow oven with programmable temperature zones.

Q

91. QA (Quality Assurance) – Ensures processes meet quality standards.
92. QFN (Quad Flat No-lead) – Compact package with exposed thermal pad.
93. QFP (Quad Flat Package) – Chip with leads on all four sides.
94. QR Code Traceability – Tracking system using printed QR codes.
95. Quick Change Feeder – Allows fast replacement during production.

R

96. Reflow Soldering – Process that melts solder paste to form joints.
97. Reel – Circular tape carrier for SMD components.
98. Rework Station – Equipment used to repair solder joints.
99. RoHS (Restriction of Hazardous Substances) – Environmental compliance regulation.
100. Run Rate – Speed or capacity of production line.